Abstract
InBiSn and InSn eutectic alloy solders are used in the packaging of the cryogenic Josephson processor. The ductile behaviour of these alloys is important to the application of joints which experience large thermal stresses. In order to characterize the mechanical behaviour at cryogenic temperatures, tensile and shear strengths of bulk solders were measured at and below room temperature. It is found that the ultimate tensile and shear strengths of bulk solders increase as temperature decreases. At low temperatures, the ultimate tensile strength of InBiSn alloy is about three times less than that of InSn alloy. The ductility of both alloys reduces at low temperatures. The fracture surfaces of both bulk solders and solder joints having an interface material (Pd and Au thin films) to the electrical contact pads (Nb thin film) were examined using SEM. Ductile fracture mode was observed for all the specimens down to liquid nitrogen temperature.
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