Abstract
The approximate process range for preparing the Cu–Cr–Zr alloy by selective laser melting (SLM) was determined by ANSYS simulation, and the influence of the SLM process parameters on the comprehensive properties of the SLM-formed alloy was studied by the design of experiments. The Cu–Cr–Zr alloy with optimum strength and hardness was prepared with high efficiency by optimizing the process parameters for SLM (i.e., laser power, scanning speed, and hatching distance). It is experimentally shown that tensile strength and hardness of the SLM alloy are increased by increasing laser power and decreasing scanning speed, whereas they are initially increased and then decreased by increasing the hatching distance. Moreover, strength, roughness and hardness of the SLM alloy are optimized when laser power is 460 W, scanning speed is 700 mm/s and hatching distance is 0.06 mm. The optimized properties of the SLM alloy are a tensile strength of 153.5 MPa, hardness of 119 HV, roughness of 31.384 μm and relative density of 91.62%.
Highlights
Due to their excellent thermal and electrical conductivity and mechanical properties, copper and its alloys are widely used in lead frames of integrated circuits, network cables for contacts in high-speed railways, nuclear-fusion heat-sink materials and aerospace heat-sink components [1]
Change in relative density of the selective laser melting (SLM) alloy formed under varied laser power, As relative density increased, fewer micron-sized holes formed inside the alloy, and the quality scanning speed and hatching distance for groups A, B, C and D
Cu–Cr–Zr alloy withwith good comprehensive properties was fabricated by optimizing the influence of process parameters
Summary
Due to their excellent thermal and electrical conductivity and mechanical properties, copper and its alloys are widely used in lead frames of integrated circuits, network cables for contacts in high-speed railways, nuclear-fusion heat-sink materials and aerospace heat-sink components [1]. A three-dimensional thermal-fluid model using ANSYS/fluent was established by Subin et al [23], who numerically analyzed temperature distribution, liquid–metal flow and free-surface formation in copper alloy parts. These studies mainly simulate the heat-transfer process of titanium alloy or alloy with low copper content. By comparing the microstructure and properties of the Cu–Cr–Zr alloy formed by using different SLM process parameters, the influence of laser power, scanning speed and hatching distance on the alloy properties was analyzed, and the optimum process parameters for attaining comprehensive SLM properties were obtained
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