Abstract
Epoxy adhesive was analyzed under long term thermal aging and mechanical properties and chemical degradation were observed by X-ray photoelectron spectroscopy (XPS). Long term thermal exposure of epoxy causes a noticeable reduction in adhesive properties. We developed a predictive model of temperature and time dependent aging. The temperature dependent aging behavior of epoxy adhesive shows good agreement with conventional Arrhenius equations. Using XPS analysis, we also discovered a correlation between chemical degradation and the adhesive properties. Decay of C-C bonding ratio induced chain-scission of epoxy adhesive; increase of total numbers of C-O and C═O induced oxidation of epoxy adhesive during thermal exposure.
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