Abstract
Mechanical properties of electroless copper deposits considered to be most important for printed circuit manufacturing process. In order to achieve sufficient performance level, the correlation between the mechanical properties and basic bath formulation and condition of electroless copper were studied.Ductility was increased with increasing copper ion, formaldehyde concentration and pH value at certain level of dissolved oxygen. However, ductility was not fully correlated with occurence of corner cracking after soldering. The differences in mechanical properties of copper were caused by the differences of crystal structure and incorporated impurities and hydrogen. It was also found that high elongation copper has 1000-1800A in grain size and low one has 700-800A in grain size.
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