Abstract
The silicon carbide particles (SiC p) dispersion-strengthened copper matrix composites (Cu/SiC p) were fabricated by composite electroforming technology. The microstructure, tensile property and wear behavior of Cu/SiC p composites were investigated. The results showed that composites with different SiC p contents were obtained. The microstructure of the composite presented a uniform distribution of SiC p in the matrix and good interfacial integrity. The hardness, yield strength and rigidity of the composites increased with increasing SiC p content, but at the cost of ductility. Increasing SiC p content in the composite was not always beneficial to the ultimate tensile strength and wear resistance. The ultimate tensile strength increased with SiC p content increasing up to 16 vol.% and decreased as exceeding 16 vol.%, and the wear mass loss decreased with SiC p content increasing up to 21 vol.% and increased again as exceeding 21 vol.%.
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