Mechanical properties of a nanocrystalline Co–Cu alloy with a high-density fine nanoscale lamellar structure

Abstract

The mechanical properties of a nanocrystalline Co–Cu alloy containing a high density of in-growth nanoscale lamellar structure with a narrow spacing of 3 nm were investigated. The Co–Cu alloy exhibited a high 0.2% proof stress of 1420 MPa and an ultimate tensile strength of 1875 MPa. Also, the activation volume was 3.3b3. This low value is attributed to the emission of dislocations from boundaries of the nanoscale lamellar structure due to the stress concentration.