Abstract
AbstractPolysilsesquioxanes are finding wider uses in microelectronics. However these materials are brittle and their mechanical behaviors need to be better understood. In this paper the mechanical properties of a cured methyl silsesquioxane network are studied and they are found to vary strongly with curing conditions. In the investigated curing temperature range there seems to be a correlation between the fracture toughness (KIc) and the viscoelastic transitions, which are affected by the network crosslink density. A higher crosslink density suppresses the cc and β transitions and reduces the KIc. A toughening approach is designed and its applicability is demonstrated by the increased fracture toughness.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
