Mechanical Properties and Microstructural Characterization of Cu-4.3 Pct Sn Fabricated by Selective Laser Melting

Abstract

Components were fabricated via selective laser melting (SLM) of prealloyed Cu-4.3 pct Sn powder and heat treated at 873 K and 1173 K (600 °C and 900 °C) for 1 hour. Tensile testing, conductivity measurement, and detailed microstructural characterization were carried out on samples in the as-printed and heat-treated conditions. Optimization of build parameters resulted in samples with around 97 pct density with a yield strength of 274 MPa, an electrical conductivity of 24.1 pct IACS, and an elongation of 5.6 pct. Heat treatment resulted in lower yield strength with significant increases in ductility due to recrystallization and a decrease in dislocation density. Tensile sample geometry and surface finish also showed a significant effect on measured yield strength but a negligible change in measured ductility. Microstructural characterization indicated that grains primarily grow epitaxially with a submicron cellular solidification substructure. Nanometer scale tin dioxide particles identified via X-ray diffraction were found throughout the structure in the tin-rich intercellular regions.