Abstract
A new composite polishing plate for polishing of CVD diamond films has been designed. The displacement and stress distributions of the high speed rotation polishing plate have been investigated due to centrifugal forces, and the polishing mechanism of super-high polishing has been analyzed by using X-ray photo-electron spectroscopy. The results showed that the displacements both in axial and radial increase with the increasing of the rotational speed. When the rotation speed reached to 1200 rad/s, the von Mises equivalent stress is about 242 MPa, which is safe for the composite polishing plate. Additional, the polishing mechanism is mainly the chemical reaction between carbon and titanium during the super-high speed polishing. At elevated temperature, the chemical reaction between oxygen and titanium, oxygen and carbon can also occur.
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