Abstract
Abstract For this study, bisphenol A epoxy resin (DGEBA) was used as the resin matrix, and 3,3’-diaminodiphenyl sulfone (33DDS) was used as the curing agent. The effects of different cross-linking densities on the mechanical properties of epoxy resins were studied by molecular dynamics (MD) simulation, and the changes in the mechanical properties of epoxy resins under five different cross-linking density levels were predicted [1]. The results showed that as the cross-linking density of the epoxy resin increased, the mechanical parameters (such as elastic modulus, shear modulus, and bulk modulus) of the epoxy resin system also increased. This indicates the importance of improving the curing process of epoxy resin to enhance its mechanical properties.
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