Abstract
A new theoretical model was developed for a pull-off adhesion test using an axisymmetric flat punch and a rectangular flat punch adhered to a thin polymer film interface. An elastic solution was derived to portray the mechanical integrity of the thin film. A mechanical energy release rate was calculated numerically. As the punch was pulled away from the adhered film, the film deformed under mixed bending and stretching. Both stiffness and thickness of the film were allowed to vary. The derived solid-film ‘pull-off’ events sharply contrast with the abrupt pull-off in solid–solid adhesion as predicted by the classical JKR theory.
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