Abstract

Several kinds of polyimide (PI) films stemmed out of 4, 4’–diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films’ mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films’ performance is significantly different as a result of their diverse structure. PI’s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI>BTDA-PI>BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI’s glass transition temperature (Tg) are, respectively, 276 °C (BTDA-PI), and 290 °C (BPDA-PI), as well as 302 °C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.

Highlights

  • Aromatic polyimides (PIs) have been deemed as crucial high-performance polymers classes based on the integration of excellent mechanical, electrical, and thermal properties, as well as chemical and solvent resistance [1,2,3,4,5]

  • These materials are being used in numerous applications, which range from engineering plastics under aerospace industries to the films for the printed electronic circuitry applications [6,7,8,9], as a result of the superior excellent dimensional stability, the temperature under high glass transition, good optical transparency, good electrical resistivity, low water absorption, and relative permittivity [10,11,12,13]

  • Ever since the commercialization of the Kapton type PI began the usage in the early 1960s, a series of PIs composed of different diamine and dianhydride have been reported [15,16,17,18]

Read more

Summary

Introduction

Aromatic polyimides (PIs) have been deemed as crucial high-performance polymers classes based on the integration of excellent mechanical, electrical, and thermal properties, as well as chemical and solvent resistance [1,2,3,4,5] These materials are being used in numerous applications, which range from engineering plastics under aerospace industries to the films for the printed electronic circuitry applications [6,7,8,9], as a result of the superior excellent dimensional stability, the temperature under high glass transition, good optical transparency, good electrical resistivity, low water absorption, and relative permittivity [10,11,12,13]. Understanding of PI films’ structure–property relationships in practical applications

Materials
Integration of PI Films
Characterization and Tests
Mechanical Properties of PI Films
Dielectric Attributed Harbored by PI Films
Breakdown
Thermal
Conclusions
Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call