Abstract
ABSTRACT Cu–Ni–Si alloys exhibit a good combination of strength and electrical conductivity and may be a potential candidate for utilisation in electrotechnical applications. In this work, the mechanical behaviour and its relation to the microstructure of a Cu–Ni–Si alloy, subjected to different solution heat treatment cycles, were investigated. Tensile, bend and hardness testing, in addition to Optical and Scanning Electron Microscopy, were employed, as the main analytical techniques, in the context of the present investigation. This paper is part of a Thematic Issue on Copper and its Alloys.
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