Abstract
A complete report on mechanical behavior of large flip chip plastic ball grid array (FC-PBGA) packages under reflow condition is presented in this chapter. The coefficients of thermal expansion (CTE) of BT substrates were also measured using electronic speckle pattern interferometry (ESPI) and were found to change significantly at different processing stages. Careful selection of a substrate CTE is needed for accurate warpage prediction using the finite element method. A linear relationship between the temperature and the FC-PBGA warpage was observed from the data measured using both the phase-shifted shadow moire and the ESPI. Zero warpage was measured at approximately 150◦C regardless of the size of the chip composed of the package. An optimal warpage design for FC-PBGA was also suggested.
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