Mechanical behavior and underlying mechanism of nickel-based superalloy during coupling electrical pulse and ultrasonic treatment

Abstract

Coupling electric pulse and ultrasonic treatment (CEPUT) is a multi-energy field-assisted forming technology that can improve the forming efficiency of materials. The current research focused on the surface modification of materials by CEPUT, lacking the explanation of its coupling mechanism. In this study, Inconel 718 was adopted as the research object to observe the mechanical behavior and microstructure after CEPUT uniaxial tension experiment. The deformation tendency of grain under coupling multi-energy field was described by analyzing the texture evolution and dislocation morphology. The coupled mechanism of ultrasonic vibration and pulsed current was revealed in CEPUT. The experimental results revealed that there was a nonlinear relationship between the increase of flow stress softening efficiency and the increase of ultrasonic energy density and current density. This phenomenon was the macroscopic manifestation of interference between initial ultrasonic vibration and vibration after energy attenuation, which was related to dislocation slip and recrystallization under coupled multi-field. In addition, more efficient path of dislocation slip was demonstrated through the CEPUT. Among them, ultrasonic vibration caused local resistance to rise at the dislocation source and dislocation pile-up, which strengthened the local Joule heating effect; while the pulse current reduced the activation energy required for dislocation slip near the waning point. This effectively reduced the resistance of dislocation motion near the pinning point, promoting the chance of dislocation crossing and annihilation. Meanwhile, the high temperature caused by pulsed current and local high strain caused by ultrasonic vibration were more favorable to dynamic recrystallization, and the change of grain orientation was more active. The texture strength and grain orientation of the matrix can be effectively controlled by adjusting the input power of ultrasonic vibration and pulsed current.