Abstract
Aging behavior of the Cu-Mg-Ce alloy of various cold deformations with aging temperature ranging from 400 to 480 °C and aging time ranging from 10 to 480 min was investigated. Effects of the secondary phase on hardness and electrical conductivity were discussed. Electrical conductivity and phase transformation kinetics equations were established. The addition of Ce promoted the precipitation of the secondary phase, improved the hardness, and delayed the dynamic recrystallization of the Cu-Mg alloy in the aging process. Nanoscale secondary phases in the aging process were determined to be α-Fe and Mg3P2. α-Fe particles lead to dispersion strengthening and the peak-aging stage. The Mg3P2 particles play an important role in inhibiting the motion of grain boundaries and the precipitation of coarse Fe2P or Fe3P. The secondary phases α-Fe and Mg3P2 pinned at dislocations and twin boundaries improved the softening resistance of the Cu-Mg-Ce alloy. Optimal aging parameters of the Cu-Mg-Ce alloy are 60% cold deformation aged at 420 °C for 20 min with 205.82 HV hardness, 73.59%IACS electrical conductivity, 597 MPa ultimate tensile strength, and 4.39% elongation.
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