Mechanical and electrical performances of ternary Cu-2.8%Ni-0.7%Si alloy modulated by ultrasonic solidification

Abstract

One-dimensional (1D) and three-dimensional (3D) ultrasounds were introduced into the solidification process of ternary Cu-2.8wt%Ni-0.7wt%Si alloy together with the in-situ measurements of acoustic fields. In the case of 1D ultrasound, stable cavitation was the main form of acoustic energy transmission. The grain size of α-Cu dendrites was reduced because stable cavitation improved the wetting between impurities and alloy melt, which further promoted nucleation process. When 3D ultrasounds were applied, transient cavitation was the dominant mode of acoustic energy dissipation. This induced local high undercooling in alloy melt, causing a significant increase in bulk nucleation rates and the formation of numerous tiny α-Cu equiaxed grains. Meanwhile, as ultrasonic dimension increased, the strengthened acoustic streaming accelerated solute and thermal diffusion and weakened the preferred orientation of growing α-Cu grains. The proportion of low-angle grain boundaries (LAGBs) increased consequently, which suppressed the nucleation and growth of δ-Ni2Si discontinuous precipitates (DPs) during subsequent annealing treatment. The tensile strength and electrical conductivity of 3D ultrasonically solidified alloy after annealing reached 688.2 MPa and 2.7×107 S/m respectively, showing obvious advantages in synergetic mechanical and electrical performances.