Abstract

The epitaxial deposition of a precise number, or even fractions, of monolayers of indium (In)-rich semiconductors onto gallium arsenide (GaAs) substrates enables the creation of quantum dots based on InAs, InGaAs and indium phosphide (InP) for infrared light-emitting and laser diodes and the formation of indium antimonide (InSb)/GaAs strained layer superlattices. Here, a facile method based on energy-dispersive X-ray spectroscopy (EDXS) in a scanning electron microscope (SEM) is presented that allows the indium content of a single semiconductor layer deposited on a gallium arsenide substrate to be measured with relatively high accuracy (±0.7 monolayers). As the procedure works in top-down geometry, where any part of a wafer can be inspected, measuring the In content of the surface layer in one location without destroying it can also be used to map the lateral indium distribution during quantum dot formation and is a method suitable as an in-situ quality control tool for epitaxy.

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