Measurement of Thermal expansion coefficient of solid Materials by double slit Interferometric method

Abstract

Thermal expansion coefficient is a regular coefficient to describe the variation of geometric characteristics of matter under the action of thermal expansion and cold shrinkage effect, and it is an important index to measure the thermal stability of materials. A device for measuring the thermal expansion coefficient of solid materials by Yang’s double slit interferometric method with variable double slit spacing is mainly composed of laser, sliding Young double slit structure, temperature measuring and controlling instrument, shading tube, receiving device and solid material to be measured. The solid material is heated by ring heater, the temperature of solid material is displayed and controlled by temperature measuring and controlling instrument, and the change of stripe spacing is recorded by linear CCD image sensor. Compared with the traditional optical leverage method, this measuring device and method can significantly improve the accuracy of the measurement results and reduce the uncertainty of the measurement results.