Abstract
AbstractThermal diffusivity D of filler‐polyimide composites was investigated using flash radiometry. The fillers used were: diamond, alumina, boron nitride, aluminium nitride, silicon carbide, and silicon carbide whiskers, Composite films were prepared by casting a polyamic acid solution with dispersed filler on a glass plate and then annealing. The effects of filler type, size, content, and shape on D were studied. D increased with increasing average filler particle diameter and filler content. For the composite filled with fine Al2O3 whose average particle diameter is about 0.2 μm, aggregates of filler were observed with dimensions up to a few microns. The formation of thermal paths through this aggregate enhances thermal diffusion. For the composites filled with high thermal conductivity filler such as BN and AIN, there was a strong increase in D above a filler content of 20 vol %. D was ten times larger than that of unfilled polyimide when the BN content was 54 vol %. D of the SiC‐whisker composite increased strongly up to a filler content of 18 vol %. Above this content D significantly decreased, probably because of interconnected voids formed by mold shrinkage.
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