Abstract
With the increasing amount of composite materials used for aircraft structures, structural bonding and bonded repairs are needed. However, a huge challenge is the availability of reliable material properties for the adhesives. A common approach for determining the material properties is to use adhesively bonded tubular butt joint specimens, tested in a biaxial testing system. In order to determine stress-strain curves of the adhesive systems local strain or deformation measurements needs to be performed. But because of the small bondline thickness of an e.g. epoxy film adhesive, the resulting deformations are very small. Within this study, two different strain measurement techniques are used. First a high resolution digital image correlation (DIC) system. Second capacitive sensors combined in a manner, which allows the decoupled measuring of axial and torsional movements. Both methods and results are compared and discussed. Both have their advantages and the ability to measure the small deformations.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
