Abstract
An approach is developed to investigate the dynamic tensile fracture of nanocrystalline copper by laser irradiation loading. A push-pull type velocity interferometer system for any reflector is used to measure the rear free surface velocity profiles. The dynamic tensile strength of nanocrystalline copper films is determined from these velocity profiles as a function of the tensile strain rate. Results show that the dynamic tensile strength of nanocrystalline copper film is about 3 GPa, which is much higher than that of polycrystalline bulk copper, but lower than that of single crystal copper. This dynamic tensile strength increase may be attributed to constraints on dislocation motion by more grain boundaries in nanocrystalline materials.
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