Abstract
To investigate the relationship between adhesion strength of Al electroplated film and Al concentration in Mg alloy substrates and the grain size of the Mg alloy, Al electroplating was carried out with AZ31, AZ61, AZ91, and of AZ31 with different grain sizes in an ionic liquid of a mixture of aluminum chloride and 1-ethyle-3-methyl-imidazolium chloride at 283 K. Dense Al electrodeposits were formed on all the substrates. The adhesion strength increased with increases in the Al content of the Mg alloys. Increasing the average grain size also resulted in increases in the adhesive strength.
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