Abstract

This research improves H decohesion mechanism-based modeling of intergranular stress corrosion cracking in a Ni-Cu superalloy, Monel K-500. New cracking data plus improved model parameters lead to accurate predictions of the cathodic potential dependencies of KTH and H diffusion-limited da/dtII for Monel K-500 under slow-rising K in 0.6 M NaCl solution. Experiments and modeling demonstrate that IGSCC is eliminated for applied potentials more positive than a critical level between −900 and −840 mVSCE, but slow-subcritical cracking persists by a microvoid-based mechanism.

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