Abstract

The influence of water adsorption on dielectric constants of the porous silica low- dielectric films was investigated. The amount of water adsorption inside pores was calculated by a capacitance value, a gas adsorption measurement, the BET (Brunauer, Emmett, and Teller) adsorption theory, and the Kirkwood microscopic theory of water dielectrics. A hexamethyldisilazane (HMDS) vapor treatment was introduced to make porous silica low- films hydrophobic, and the effect of the HMDS vapor treatment was investigated quantitatively. The BET adsorption at a low partial pressure of water vapor ( for the HMDS-treated film, for the nontreated film) was investigated by a capacitance value. The results showed that the BET adsorptions of the HMDS-treated and the nontreated films were almost the same. A water cluster formation inside pores, at a high partial pressure of water vapor ( for the HMDS-treated film and for the nontreated film), was investigated by a capacitance value and a gas adsorption measurement. The results showed that the HMDS vapor treatment suppressed the water cluster formation, and this suppression could lower the dielectric constant for the porous silica film.

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