Abstract
We prepare Cu/Ni bilayer films by depositing the incident atoms on Cu substrates with various surface orientations and under different temperatures and investigate interfacial structure, surface roughness, radial distribution function and hardness of the films. We find that the incident atoms can penetrate (001) substrate more easily than other surfaces, resulting in a transitional layer consisting of two kinds of atoms. Stacking faults are generated in the bilayer films deposited on the (111) substrate, which can reduce misfit strain and thus account for the layer growth mode of the films. The surface roughness decreases with the increase in deposition temperature. Moreover, we also find that a certain degree of roughness benefits the formation of coherent interface due to the tilted-layer epitaxial growth. The hardness differs for the films deposited at different temperatures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.