MCM-L Cost Model & Application Case Study

Abstract

Since the recent advent of the MultiChip Module (MCM) technology options, many potential MCM customers are grappling on how to partition a new or existing system design to utilize the benefits of MCMs. In addition to the design issues, customers are having to look beyond the traditional board design cost models to justify the higher costs of MCMs over the single chip package options. These factors greatly influence the decision whether to design or redesign a system with an MCM. Unless the customer can readily determine whether cost savings or parity can be achieved with a MCM, the decision to use an MCM is either postponed or dropped as an alternative. This paper will outline the design and cost methods that were used in a telecommunication switching equipment application. This application substituted a multi-layer, four chip, 160 lead MCM-L PQFP (plastic quad flat pack) package in place of four single chip packages. The methods used in this case study delves beyond the traditional single chip versus multichip package comparisons to justify the use of a MCM-L package as a cost effective alternative to single chip semiconductor devices.