Abstract
Mathematical Modeling of Stress in Circuit Cards Represented by Mechanical Oscillatory Systems
Highlights
Variety of modern electronic packages and their parts such as circuit cards (CC) or case walls, etc. are very likely to be exposed to mechanical impacts such as vibration and shocks during their operation
Comparative analysis of mathematical modeling, MatLab simulation and experimental determination of maximal dynamic stress and deflection accomplished for three types of oscillatory systems verified proximity of obtained results
Single-mass oscillatory system is proposed as equivalent to multiple mass or uniformly distributed oscillatory systems on condition of their equal mass, geometric, elastic and dissipation characteristics in resonance frequency correspondent to the main mode of oscillation, so mathematical model designed for single-mass oscillatory system is recommended for strength and stiffness assessment in engineering calculations where possible difference in determination of stress in equivalent systems can used as safety factor
Summary
Variety of modern electronic packages and their parts such as circuit cards (CC) or case walls, etc. are very likely to be exposed to mechanical impacts such as vibration and shocks during their operation. Results of the previous research published in [10, 11] emphasized that mechanic impacts, and especially the dynamic forces in CC assemblies are likely to increase manifold so as to damage their bearing parts and electronic components, to which these forces are transmitted especially in resonant oscillations. Analytical estimation of stress and deflection conducted in the research was based on experimental verification of actual physical and mechanical parameters, which are likely to vary depending on technology, temperature, shape etc. For this purpose analytical and experimental method of sample parameters was applied.
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