Abstract
The results of optimization of the supporting structure of a block of onboard electronic equipment with a built-in single flat heat pipe in the supporting structure with an integrated heat pipe system are presented, using the example of solving a model problem with a single heat source. The comparison was carried out at an equal temperature, occupied volume and for a certain maximum temperature of electrical radio products. The results of computational modeling are presented, demonstrating a comparison of the characteristics of a single flat heat pipe with a system of sequentially located flat heat pipes. Ultimately, the studies carried out have determined the limiting values of the removed thermal power of a single heat pipe, two-level and three-level heat pipe systems with different heat carriers. The versatility of the mathematical model, supplemented by the optimization method, has been confirmed
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