Abstract
Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are the subjects of a report by the US National Materials Advisory Board ∗ ∗ Materials for high-density electronic packaging and interconnection. Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Publication NMAB-449, National Academy Press, 1990, 140 pp, ISBN 0 309 04233X. The report is available from the Defence Technical Information Center, Cameron Station, Alexandria, VA 22304-6145, USA and is distributed outside the USA by John Wiley, priced at £12.85. . Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. The report also examines weak points in US industrial capability and presents recommendations for action. This article considers only the materials-related issues.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
