Materials and challenges of 3D printing of emerging memory devices

Abstract

The continuous development of the semiconductor industry to meet the increasing demand of modern electronic devices which can enhance computing capabilities is attributed to the exploration of efficient, simple, high-speed operation and multistate information storage capacity of electronic devices called memory devices. Nowadays, one of the main challenges the industry faces is limitations in manufacturing as the current fabrication pathway is complex and relies on the use of rigid substrates that do not match with the needs of industry for flexible, bendable electronics. 3D printing has a huge potential to address this challenge and to completely replace the current fabrication pathways and protocols. In this paper, the materials and the 3D printing technologies that have been explored to fabricate an emerging flexible, bendable memory device will be presented.