Abstract
In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results are presented.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
