Abstract
The demand of three dimensional PKG (3D PKG) effective for decreasing the mounting area with higher performance is rapidly increasing around mobile electronic devices. The form of the PKG is evolving variously depending on the usage. In this paper, we introduce the materials, material design technologies and the combination of them such as Die Bonding Film for Stacked Multi-Chip PKG, Epoxy Mold Compound and Substrate for Package on Package (PoP) and Underfill Material for Advanced Flip-Chip Package.
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