Abstract
This paper presents a novel method of improving material removal efficiency in the chemical mechanical polishing (CMP) process by optimizing the surface asperity orientation with respect to polishing motion. Feret's diameter plays a key role in increasing the number of working abrasives. Based on Feret's diameter model, an optimization method is proposed for the conditioning motion of a diamond dresser against a CMP pad. The radial velocity component of the dresser on the CMP pad is maximized by considering its direction of motion based on kinematic motion simulation. In addition, the pad cut rate profile is optimized to be uniform. Analytical and experimental investigations show that the ratio of radial and tangential velocity components is improved, yielding a larger Feret's diameter and 15% increase in the material removal rate.
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