Abstract
Material removal and surface damage of Ti 3SiC 2 ceramic during electrical discharge machining (EDM) were investigated. Melting and decomposition were found to be the main material removal mechanisms during the machining process. Material removal rate was enhanced acceleratively with increasing discharge current, i e, working voltage, u i, but increased deceleratively with pulse duration, t e. Microcracks in the surface and loose grains in the subsurface resulted from thermal shock were confirmed, and the surface damage in Ti 3SiC 2 ceramic led to a degradation of both strength and reliability.
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