Material Development Challenges in High Density Pakaging of Advanced VLSI Memory Devices

Abstract

AbstractAdvances in semiconductor memory storage technology are making possible the development of high density memory cards for hand held and portable product applications. This in turn is driving development of ever denser, ultra-thin component packages. Both materials and package design must be more robust in order for next generation packages to withstand surface mount reflow soldering stresses. Trade-offs among ercapsulant properties may be possible in view of new interconnect, die surface protection and leadframe design technologies which are being adopted for high density packaging. Materials and packaging engineers are challenged to capitalize on opportunities offered by these changes in order to optimize strength and moisture resistarnce in developing encapsulating materials for the new generation of packages.