Abstract

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano‐structure polymer–ceramic composite with very high dielectric constant (εr ~ 150 , a new record for the highest reported εr value of nano‐composite) has been developed in our previous work. RF application of embedded capacitors requires that insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer–ceramic nano‐composite. Results show that this material has faily high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. 85/85 TH aging test has been performed and it had shown this novel high K material has good reliability. An embedded capacitor prototype with capacitance density of 35 nF/cm2 has been manufactured using this nano‐composite with spinning coating technology. This novel nano‐composite can be used for the integral capacitors in the RF applications.

Highlights

  • The fundamental building components for all electronic packaging systems consist of active and passive components on an interconnecting substrate [1]

  • It was found that the decrease of the dielectric constant was less than 10% from 10 kHz to 1.8 GHz

  • The leakage current is less than 2.6 mA=cm2 under 6 V dc bias, and it will level off at higher dc bias

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Summary

Introduction

The fundamental building components for all electronic packaging systems consist of active and passive components on an interconnecting substrate [1]. The polymeric matrix (epoxy) possesses low processing temperatures applicable for PWB applications, but has a low dielectric constant value of around 3 to 4. The ceramic fillers (Barium Titanate and Lead magnesium niobate-lead titanate (PMN-PT) inherently have a high dielectric constant value of 3000 and 19,316 respectively, making it suitable for decoupling applications.

Results
Conclusion

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