Abstract
Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm2, with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.
Highlights
Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics
A novel approach using controlled crack formation in electrode-bridge structures made of a brittle material has been proposed[24] and demonstrated[25,26] for highly parallel fabrication of sub-3 nm nanogap electrodes made of brittle electrode materials such as titanium nitride (TiN)
We demonstrate the suitability of our crack-defined break junction (CDBJ) for studying electrical transport properties of molecules from room temperature down to 7 K by measuring molecular junctions formed by contacting oligo (OPE3) using CDBJs
Summary
Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. Practical molecular electronics based on solid-state devices will require the integration of arrays of interconnected molecular junctions into circuits and systems[1,2,3,4,5] Before this becomes possible, new methodologies have to be developed for scalable and reproducible fabrication of nanogap electrodes featuring sub-3 nm wide gaps[6,7,8,9,10]. The methodology to realize CDBJs combines conventional wafer-scale semiconductor fabrication for the fabrication of metal constrictions, and crack formation for the highly parallel and self-induced breaking of the metal constrictions This unique association of patterning techniques leads to a truly parallel fabrication scheme, whereby the processing time is independent of the device density on the substrate. We demonstrate the suitability of our CDBJs for studying electrical transport properties of molecules from room temperature down to 7 K by measuring molecular junctions formed by contacting oligo (phenylene ethynylene) (OPE3) using CDBJs
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
