Year-end Sale % OFF 
Abstract
High-rate electrodeposition of copper from CuSO4-H2SO4 baths can be achieved by using crossflow of solution. To obtain copper layers of uniform thickness and quality, a new type of electrolytic cell, the helix cell, has been proposed. An experimental dimensionless relation has been given to describe the mass transfer to a round bar, in crossflow, in a helix cell. Moreover, the current efficiency of copper deposition has been obtained as a function of current density, flow rate of solution, temperature and weight per cent CuSO4 in the CuSO4-H2SO4 solution.
Submitted Version (
Free)
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
