Abstract
AbstractMaskless patterning of alumina (A12O3) films of various thicknesses and ceramic (TiC-Al2O3) substrate material was accomplished by using pulsed excimer and Nd:YAG laser systems. Etched structure size was defined through the computer software which also controls the workpiece position and laser operating parameters. Etch profile, materials removal rate and surface roughness was found to be dependent on laser emission wavelength, fluence, pulse rate and relative scan speed. Smoother etching was obtained with the excimer lasers. The etch characteristics are compared with those of the polymeric and metallic materials. Various potential applications of this laser based etching process in microelectronic and micromagnetic device fabrication are identified.
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