Maskless interdigitated a-Si:H PECVD process on full M0 c-Si wafer: Homogeneity and passivation assessment

Abstract

In this work, the use of a novel, large area, mask-less and contact-less patterning technique is demonstrated for the first time, showing the localized deposition of hydrogenated amorphous silicon (a-Si:H) in a desired pattern over the full surface of an M0 (156 mm × 156 mm) solar wafer. The patterning functionality is achieved through a custom-designed RF electrode possessing a series of “slits” and placed in close proximity to the substrate in a plasma enhanced chemical vapor deposition (PECVD) chamber. Under a certain set of process conditions, a plasma only ignites within these slits, and the localized plasma results in localized patterned deposition of a-Si:H with feature widths compatible with application in an interdigitated back contact (IBC) solar cell design (760 μm). The homogeneity of the finger width and thickness over the surface of the M0 wafer is evaluated, with a 37% variation in thickness (at very high deposition rate, ∼1 nm/s) but only a 4.7% variation in finger width (MSE). With this application in mind, the impact of the deposition of such “fingers” on an underlying “blanket” passivation layer is assessed. Passivation is maintained or improved up to a given finger/blanket thickness ratio, above which the passivation is degraded. It is shown that the acceptable process window contains suitable thickness values for heterojunction (HJT) IBC solar cells, and the physical processes at the origin of this phenomenological observation are discussed.