Manufacturing of prestressed piezoelectric unimorphs using a postfired biasing layer

Abstract

A novel manufacturing method for prestressed piezoelectric unimorphs is introduced and the actuator properties are examined. Prestressed PZT 5A and PZT 5H unimorphs with piezo material thickness of 250 microm and 375 microm were manufactured by using sintering and thermal shrinkage of the prestressing material. The process was carried out by screen printing a layer of AgPd paste on one side of the sintered bulk ceramic. As an alternative method, dielectric low temperature co-fired ceramic (LTCC) tape was used as the prestressing material. Different configurations were tested to obtain high displacements and to make a comparison between materials. After firing, the samples were poled, and the displacement versus load characteristics of the resulting actuators were investigated. A maximum displacement of 118 microm was obtained from a 250 microm thick, prestressed PZT 5H actuator with a diameter of 25 mm, in which LTCC tape was used as the prestressing layer. Similarly, the PZT 5H material provided a maximum displacement of 63 microm with a screen-printed AgPd prestressing layer. The manufacturing method described offers a novel approach for the production of a wide range of integrated active structures on, for instance, an LTCC circuit board. This is especially important because piezoelectric bulk materials with high piezoelectric coefficients can be used to produce high displacements.