Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Abstract

This article is the third and final article in a series dedicated to reviewing each process step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock, crystallization and wafering, cell fabrication, and module manufacturing. The goal of these papers is to identify relevant metrology techniques that can be utilized to improve the quality and durability of the final product. The focus of this article is on the module manufacturing process. The c-Si PV module fabrication process can be divided into three primary areas; (1) stringing and tabbing, (2) lamination, and (3) integration of junction box and bypass diode(s). Each of these processing steps can impact the reliability and durability of PV modules in the field. The ultimate goal of this article is to identify appropriate metrology techniques and characterization methods that can be utilized within a module manufacturing facility to improve the reliability and durability of the final product. Additionally, a gap analysis is carried out to identify areas in need of further research and a discussion is provided that addresses new challenges for advanced materials and emerging technologies.