Abstract
In thermal stress cleaving with laser, the substrates of brittle material are divided by crack propagation due to the thermal stress. Therefore, distribution of the stress is essential and should be controlled properly for high accuracy of process, but boundary conditions and unexpected disturbances sometimes cause asymmetry of the distribution. This paper concerns a photoelastic observation technique to investigate the asymmetry of thermal stress distribution, which provides the isoclinic fringe pattern and the isochromatic fringe pattern around the crack propagating in the laser cleaving process for brittle material substrates. The technique can visualize the asymmetry of the distribution and some results are reported in this paper for transparent substrates.
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