Abstract
Magnetron sputtering sources can be defined as diode devices in which magnetic fields are used in concert with the cathode surface to form electron traps which are so configured that the E×B electron-drift currents close on themselves. Coaxial cylindrical magnetron sputtering sources in which post or hollow cathodes are operated in axial magnetic fields have been reported for a number of years. However, their performance is limited by end losses. A remarkable performance is achieved when the end losses are eliminated by proper shaping of the magnetic field or by using suitably placed electron-reflecting surfaces. High currents and sputtering rates can be obtained, nearly independent of voltage, even at low pressures. This characterizes what has been defined as the magnetron mode of operation. This paper reviews the basic principles that underly the operation of dc sputtering sources in the magnetron mode with particular emphasis on cylindrical magnetrons. The important attributes of these devices as sputtering sources are also reviewed.
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