Abstract
Fundamental to the development of three-dimensional microelectronic fabrication is a material that enables vertical geometries. Here we show low-melting-point metal alloys containing iron dispersions that can be remotely manipulated by magnetic fields to create vertical geometries and thus enable novel three-dimensional assemblies. These iron dispersions enhance the mechanical properties needed for strong, reliable interconnects without significantly altering the electrical properties of the alloys. Additionally, these iron dispersions act as susceptors for magnetic induction heating, allowing the rapid melting of these novel alloys at temperatures lower than those usually reported for conventional metal alloys. By localizing high temperatures and by reducing temperature excursions, the materials and methods described have potential in a variety of device fabrication applications.
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