Abstract
CoNiP and CoNiPCu films were plated both electrolessly and with simultaneous electrolysis applied. The solutions contained glycine as ligand and ratio Co 2+:Ni 2+=0.06:0.04 at pH 9 and 10. An increase in Cu 2+ concentration up to 3 mmol l −1 decreased Co and increased Cu content in the films. With an increase in cathodic polarization, the Cu content of the films decreased and approached a constant value. Films coercivity passed through the maximum, which was determined by such a potential which enabled to get approximately 5.5% of phosphorus in the film and, thus, to form a specific microstructure. The increase in Cu 2+ concentration resulted in a decrease of coercivity maximum due to the formation of the film with finer grains.
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