Abstract
Abstract CuO films were deposited on fused silica substrates by using sol-gel method. Nanocrystalline nickel was incorporated in CuO in varying concentrations to form Ni:CuO films. Field emission scanning electron microscopy (FESEM), energy dispersive X-ray spectroscopy (EDAX), X-ray diffraction (XRD), and Raman spectroscopy measurements were carried out to characterize the films. X-ray photoelectron spectroscopy (XPS) studies indicated that Ni ions successfully substituted Cu in the CuO lattice. Superconducting quantum interface device (SQUID) measurements were carried out to measure the magnetization of the films which decreased with increase in temperature. Coercive field and residual magnetization in the Ni:CuO films were measured as a function of nickel content in the CuO films.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
