Magnetic properties of nanocrystalline CoPt electrodeposited films. Influence of P incorporation

Abstract

Platinum-rich CoPt films have been electrodeposited with the aim of preparing hard magnetic films on silicon-based substrates without the need for subsequent annealing. Electrodeposition conditions have permitted the crystalline structure of the films to be controlled. Pt percentages of up to 60–65 wt.% have been attained while maintaining the hexagonal Co phase, leading to CoPt films with moderate coercivity and good corrosion resistance. However, when low deposition potentials were used, CoPt films with higher Pt percentages were obtained, but in this case, the films exhibited an fcc structure, having lower coercivity and less corrosion resistance. The presence of hypophosphite in the solution limited the platinum percentage in the deposited CoPtP films, but an hexagonal close-packed (hcp) structure was always observed in this case. The incorporation of P into the deposits led to increases in both the coercivity of the films and the corrosion resistance of the coatings, with respect to pure CoPt. The highest coercivity was obtained for hcp CoPtP deposits with 40 wt.% of Pt.