Abstract
Electromigration-induced magnetic failures in NiFe/(Co)/Cu/(Co)/NiFe spin-valve (SV) multilayers have been investigated. Electrically stressed NiFe/Cu/NiFe SV multilayers showed a dramatic reduction of magnetic moment up to 41%, and a shift of interlayer coupling characteristics, while no obvious magnetic degradation was observed in the NiFe/Co/Cu/Co/NiFe SV multilayers. It was experimentally confirmed that the magnetic degradation of the NiFe/Cu/NiFe SV multilayers is primarily due to the formation of Ni–Cu intermixing caused by the electromigration-induced Cu spacer inter-diffusion. Furthermore, it was demonstrated that an ultra thin Co diffusion barrier at the NiFe/Cu interface is promisingly effective to improve the magnetic stability of NiFe/(Co)/Cu/(Co)/NiFe SV multilayers against electromigration.
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